Epoxy Chip Seal Bridge Deck Preservation in Yavapai County, Arizona – Project #2323275
Agency: | Yavapai County |
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Level of Government: | State & Local |
Category: |
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Opps ID: | NBD10182269466288855 |
Posted Date: | Mar 21, 2023 |
Due Date: | Mar 23, 2023 |
Source: | https://yavapaiaz.gov/bids/pub... |
The scope of work includes furnishing of all labor, materials, equipment, fixtures and services required for the placement of epoxy chip seal to 3 (three) bridge decks on Iron Springs Road at Mile Marker 18.06, Mile Marker 23.27 and Mile Marker 24.24. Total estimated quantity of area to receive the epoxy chip seal is approximately 13,519 square feet. Other associated work includes bridge deck concrete spall repair and restoring pavement markings. All work is to be done in accordance with the plans, specifications, and contract documents.
There has been a MANDATORY pre-bid meeting scheduled for 10:00 a.m., Tuesday, March 14, 2023, hosted by Yavapai County Public Works through an online virtual meeting portal. Detailed meeting instructions will be included in the contract documents. Any questions or concerns about the project will be addressed at that time.
ENGINEER'S ESTIMATE: $402,365.00
Closing Date: 3/23/2023
Last Modified: 03/21/2023 11:58
Sign-In Sheet for Mandatory Pre-Bid Meeting 2323275 | ||
Part A - Project Documents | ||
Instructions for Bidding 2323275 | ||
Instructions for Mandatory Pre-Bid Meeting 2323275 | ||
Project Provisions and Specifications 2323275 | ||
Part B - Project Plansheets | ||
Epoxy Chip Seal Planset 2323275 | ||
Part C - Bidding Documents | ||
Envelope #1 - This sealed envelope shall contain the following items: Completed and signed Proposal, Surety Bid Bond, Affidavit of Non-collusion, Subcontracting Certification, Addenda (if any), and sealed Envelope #2. | ||
C.1 - Contract Documents | ||
Required documents to be completed and signed. | ||
Proposal 2323275 | ||
Surety Bid Bond 2323275 | ||
Affidavit of No Collusion 2323275 | ||
Subcontracting Certification 2323275 | ||
C.2 - Addenda | ||
Addendum 1 - 2323275 | ||
C.3 - Envelope #2 | ||
Required document to be completed and signed. | ||
Bid Schedule - Revised March 21, 2023 - 2323275 |
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