Semiconductor Assy, DieAttach, Epoxy/Eutectic, Wire Bond, Wedge, Ball, Ribbon, FlipChip, StudBumping, GlobTop, Sealing. PICK&PLACE, WafflePack, GelPak, Tape&Reel PACKAGING, RFID, Hybrids, IC, Photonics, MEMS, RF, Interactive Engr'g.

Auto & Semi Auto Pick & Place Equipment

semiconductor, assembly, packaging, bga, pba, side, braze, lcc, epoxy, eutectic, die, attach, lid, wire, bond, bonder, bonding, gold, aluminum, au, al, ball, wedge, ribbon, conductive, non, hermetic, re-flow, esec, sikama, plasma, cleaning, automatic, manual, pcb, flip, chip, pick, place, waffle, gel, pack, pak, ball, testing, shear, pull, royce, profiling, oven, mems, back-end, dicing, dice, die, wafer, silicon, glass, quartz, pzt, fr4, disco, k&s, dad, 641, 7500, nitto, uv, exposure, 200 mm, ceramic, bumped, process, development, interactive, engineering, prototype, quick, turn, low, medium, volume, proof, concept, research, development, r&d, tempe, phoenix, arizona, az

advotech company inc. - located in tempe (phoenix) arizona. prototype to medium volume semiconductor assembly, packaging, and dicing service specializing in proof-of-concept and process development.